8779 Datasheet, PDF

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	87791-0114	141Kb/3P	2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
	87791-0116	141Kb/3P	2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
	87791-0120	141Kb/3P	2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
	87792-1114	481Kb/9P	2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
	87792-1116	481Kb/9P	2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
	87792-1120	481Kb/9P	2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging
	87792-2116	481Kb/9P	2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
	87792-2120	481Kb/9P	2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap
	87794-0001	106Kb/2P	2.50mm (.098) / 3.00mm (.118) Pitch Wire-to Board Receptacle Housing with Fuse, with Bottom Flange, 16 Circuits
	87794-0002	115Kb/2P	2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse, with Side Flange, 16 Circuits
	87797-0010	125Kb/3P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
	87797-0040	196Kb/4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
	87797-0602	260Kb/4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76關m (30關) Gold (Au) Plating, 25.60mm (1.043) Stacking Height
	87797-1200	260Kb/4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76關m (30關) Gold (Au) Plating, 8.00mm (.315) Stacking Height
	87797-1800	259Kb/4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
Belden Inc.	8779MN	221Kb/2P	SpaceMaker™, 4 Pr #22 Str TC, PO Ins, IS/OS, PVC Jkt, AWM 2937 05-05-2023
	8779MN.004100	221Kb/2P	SpaceMaker™, 4 Pr #22 Str TC, PO Ins, IS/OS, PVC Jkt, AWM 2937 05-05-2023
	8779MN.0041000	221Kb/2P	SpaceMaker™, 4 Pr #22 Str TC, PO Ins, IS/OS, PVC Jkt, AWM 2937 05-05-2023
	8779MN.006100	221Kb/2P	SpaceMaker™, 4 Pr #22 Str TC, PO Ins, IS/OS, PVC Jkt, AWM 2937 05-05-2023
	8779MN.0061000	221Kb/2P	SpaceMaker™, 4 Pr #22 Str TC, PO Ins, IS/OS, PVC Jkt, AWM 2937 05-05-2023

8779 Datasheet, PDF

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