FEATURES
7 x 7 mm to 28 x 28 mm body size with 1.4 mm body thickness
32-256 lead counts
Pre-plated frame options
Inverted pad configuration
Cu, Ag and Au wire available
Large selection of die pad sizes and custom leadframe design available
Optimal for stacked die
Pb-free RoHs compliant materials

APPLICATIONS
Amkor’s LQFPs are an ideal package for most IC semiconductor technologies such as ASIC, PMU controllers, microprocessors, gate arrays (FPGA/PLD) and PC chip sets.
LQFP packages are particularly well suited for electronic systems requiring broad performance characteristics. Such applications include laptop PCs, video/audio, telecom, RF, data acquisition, settop box, communication boards and automotive.