SFH 7770

2011-09-16

5

Maximum limits

Operating conditions

Parameter

Symbol

Value

Unit

min.

typ.

max.

Storage temperature

T

stg

– 40

+ 85

C

Supply voltage

(between

V

V

DD

- 0.3

+ 4.5

V

Maximum Voltage of SDA, SCL and INT to GND

V

dig

- 0.3

+ 3.6

V

Maximum Voltage of LED1 ... LED3 to GND_LED

V

LED

- 0.3

+ 5.5

V

Maximum Voltage between GND and GND_LED

V

LED

-500

+500

mV

Electrostatic discharge

- Human Body Model

(according to JESD22-A114-E; Class2 )

ESD

2kV

Parameter

Symbol

Value

Unit

min.

typ.

max.

Operation temperature

T

op

- 20

+ 85

C

Supply Voltage

V

DD

2.3

3.1

V

Ripple on Supply Voltage

(V

V

DD,rip

10

mV

Voltage for I/O (SDA, SCL, INT)

1)

1)

The limits for the logic levels of SCL and SDA pins are in accordance with the I²C bus specification from NXP

(UM10204 „I²C bus specification and user manual“, Rev. 03 - 19 June 2007). The same limits are valid for the logic

levels of the interrupt pin (INT): the maximum level for logic „LOW“ level is 30% of the I/O voltage

V

level for logic „HIGH“ level is 70% of the I/O voltage

V

V

IO

1.6

2.0

V

extended Voltage range for I/O (SDA, SCL, INT)

2)

2)

Extended voltage range for I²C bus communication is only valid for standard- and fast-mode. Input levels are

internally referenced to 1.8V. So „LOW“ level threshold is 30% of 1.8V and „HIGH“ level threshold is 70% of 1.8V

regardless of the external I/O voltage V

specification from NXP concerning the minimum/maximum hold time requirement.

V

IO,ext

1.6

3.1

V

Supply Voltage LED

V

LED

2.3

4.25

V

Ripple

V

LED

DC... 30kHz

30kHz ... 100MHz

V

LED,rip

500

200

mV

mV