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ISL6731AFBZ Datasheet(PDF) 13 Page - Renesas Technology Corp |
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ISL6731AFBZ Datasheet(HTML) 13 Page - Renesas Technology Corp |
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13 / 20 page ![]() ISL6731A, ISL6731B FN8582 Rev 1.00 Page 13 of 20 February 13, 2015 Protection Circuits Input Brownout, BO Protection Brownout occurs when there is a drop in the line voltage. The BO pin is a dual function pin. The BO pin detects the brownout condition and shuts down the gate driver and controller. During normal operation, the BO pin is used to compensate the effect of the input line voltage change on the voltage loop. To keep the harmonic distortion low, the corner frequency formed by the RBO and CBO should be lower than 6Hz. The BO pin is the output of the average voltage of the rectified voltage. The PFC controller is turned off when the BO pin drops below 0.4V. This protects the PFC power stage to enable operation at or below brownout condition for long periods of time. The controller resumes operation when the BO pin returns to 0.5V. The BO pin is usually connected to GND through a capacitor, CBO. To avoid distortion on the VIN pin, select CBO so that: Overcurrent Protection The peak current limit function prevents the inductor from saturation. The gate driver turns off when the current goes above the current limit set point. Overpower Protection The overpower protection is implemented by limiting the COMP pin voltage higher than 3.85V (typical). Overvoltage Protection If the voltage on the FB pin exceeds the reference voltage VREF by about 4%, the gate driver is turned off. If the voltage on the OVP pin exceeds the VREF by about 4.5%, the gate driver is turned off. The controller resumes normal operation after both OVP and FB pin drops below VREF. Over-Temperature Protection The ISL6731A and ISL6731B are protected against over-temperature conditions. When the junction temperature exceeds +160°C, the PWM shuts down. Normal operation is resumed when the junction temperature decreases below +135°C. Application Guidelines Layout Considerations As in any high frequency switching converter, layout is very important. Switching current from one power device to another can generate voltage transients across the impedances of the interconnecting bond wires and circuit traces. These interconnecting impedances should be minimized by using wide, short printed circuit traces. The critical components should be located as close together as possible using ground plane construction or single point grounding. Figure 14 shows the critical power components; Q1, D and COUT. To minimize the voltage overshoot, the interconnecting wires indicated by heavy lines should be part of the ground or the power plane in a printed circuit board. The components shown in Figure 14 should be located as close together as possible. Please note that the capacitors CVCC and CO each represent numerous physical capacitors. Locate the ISL6731A or ISL6731B within 2 inches of the MOSFET, Q1. The circuit traces for the MOSFETs’ gate and source connections from the ISL6731A and ISL6731B must be sized to handle up to 1.5A peak current. Component Selection Guidelines A 300W, universal input, PFC converter design is provided for demonstration. The design method is for a continuous current mode power factor correction boost converter with the ISL6731B. The switching frequency is 62kHz. Tables 3 shows the design parameters. BOOST INDUCTOR SELECTION First, calculate the maximum input RMS current, IINMAX. Where is the converter efficiency at VRMSmin. PF is the power factor at VRMSmin. Assuming the current is sinusoidal and the peak-to-peak ripple at line is 40%. CBO 0.22F » (EQ. 6) TABLE 3. CONVERTER DESIGN PARAMETERS PARAMETER CONDITIONS MIN TYP MAX UNIT VLINE 90 115/230 265 VAC FLINE 47 63 Hz POMAX Maximum Output Power 300 W THOLD Hold Up Time 20 ms Efficiency VLINE = 115VAC 92 % FIGURE 14. CRITICAL CURRENT POWER COMPONENTS Q1 COUT L D GATE VCC CVCC IINMAX POMAX V RMSmin ----------------------------------- = (EQ. 7) IINMAX 300W 0.92 90V ---------------------------- 3.62A == (EQ. 8) |
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