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ISL8272MAIRZ Datasheet(PDF) 7 Page - Renesas Technology Corp |
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ISL8272MAIRZ Datasheet(HTML) 7 Page - Renesas Technology Corp |
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7 / 59 page ![]() Typical Application Circuit - Single Module FIGURE 4. TYPICAL APPLICATION CIRCUIT - SINGLE MODULE VIN VDD VR55 VR5 VR VOUT VR6 VDRV SCL SDA SALRT VMON VCC VDRV1 VIN VCC ISL8272M VOUT 1.2V 50A 10µF 10µF 10µF VAUX OR VCC 3.3V TO 5V DDC SWD1 SW1 SWD2 SW2 12V 10µF 470µF BULK 4x22µF CERAMIC 8x100µF CERAMIC 4x470µF POSCAP SCL PIN STRAP RESISTORS (OPTIONAL) SDA SALRT DDC C1 C2 C3 C4 C5 C6 C7 10µF C8 C9 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 10k 10k 10k 10k 100k 6.65k NOTES: 5. R2 and R3 are not required if the PMBus host already has I2C pull-up resistors. 6. Only one R4 per DDC bus is required when multiple modules share the same DDC bus. 7. R7 through R12 can be selected according to the tables for the pin-strap resistor setting in this document. If the PMBus configuration is chosen to overwrite the pin-strap configuration, R8 through R12 can be non-populated. 8. V25, VR and VR55 do not need external capacitors. V25 can be no connection. Note 5 Note 5 Note 6 Note 7 |
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