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LRTB-G6SF Datasheet(PDF) 18 Page - OSRAM GmbH |
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LRTB-G6SF Datasheet(HTML) 18 Page - OSRAM GmbH |
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18 / 23 page  2010-12-02 18 LRTB G6SF Empfohlenes Lötpaddesign8) 9) Seite 23 IR Reflow Löten Recommended Solder Pad8) 9) page 23 IR Reflow Soldering Empfohlenes Platinendesign für cluster mit 6-lead TOPLED ® in Serienschaltung Recommended PCB-Design for cluster with 6-lead TOPLED® in Series Connection 0.8 (0.031) 0.8 (0.031) 0.35 (0.014) Gehäusemarkierung Package marking Solder resist Lötstopplack improved heat dissipation 16 mm per anode pad for 2 OHPY0031 A3 C3 C1 C2 A2 A1 Gehäusemarkierung Package marking 0.35 (0.014) 0.6 (0.024) OHPY2398 Anode 1 Anode 3 Anode 2 Cathode 1 Cathode 2 Cathode 3 |
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