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S29PL127J65 Datasheet(PDF) 21 Page - SPANSION |
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S29PL127J65 Datasheet(HTML) 21 Page - SPANSION |
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21 / 106 page  April 7, 2005 31107A62 S29PL127J/S29PL129J/S29PL064J/S29PL032J 19 PRE L I M INARY 56-pin TSOP 20 x 14 mm Configuration (PL127J) For this family of products, a single multi-chip compatible package is offered for each density to allow both standalone and multi-chip qualification using a single, adaptable package. This new methodology allows package standardization resulting in faster development. The multi-chip compatible package includes all the pins required for standalone device operation and verification. In addition, extra pins are included for insertion of common data storage or logic devices to be used for multi-chip products. If a standalone device is required, the extra multi-chip specific pins are not connected and the standalone device operates normally. The multi-chip compatible package sizes were chosen to serve the largest number of combinations possible. There are only a few cases where a larger package size would be required to accommodate the multi-chip combination. This multi-chip compatible package set does not allow for direct package migration from the Am29BDS128H, Am29BDS128G, Am29BDS640G products, which use legacy standalone packages. Special Package Handling Instructions Special handling is required for Flash Memory products in molded packages (TSOP, BGA, PDIP, SSOP, PLCC). The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 RESET# RY/BY# A0 A1 A2 A3 A4 A5 VCC DQ0 DQ1 DQ2 DQ3 VSSQ DQ4 DQ5 DQ6 DQ7 VSS NC A6 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 WP#/ACC WE# NC A22 A21 A20 OE# NC CE# VSS DQ15 DQ14 DQ13 DQ12 VSSQ VCCQ DQ11 DQ10 DQ9 DQ8 VCC A19 23 24 25 26 27 28 A7 A8 A9 A10 A11 A12 34 33 32 31 30 29 A18 A17 A16 A15 A14 A13 VCCQ 56-pin TSOP |
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