HIN202E datasheet(21/23 Pages) RENESAS

21 / 23 page

HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E

FN4315 Rev 17.00

Page 21 of 23

September 14, 2015

Package Outline Drawing

M24.3

24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)

Rev 2, 3/11

TOP VIEW

NOTES:

1. Dimensioning and tolerancing per ANSI Y14.5M-1982.

2. Package length does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

3. Package width does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.25mm

(0.010 inch) per side.

4. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

5. Terminal numbers are shown for reference only.

6. The lead width as measured 0.36mm (0.014 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm

(0.024 inch).

7. Controlling dimension: MILLIMETER. Converted inch dimensions in

( ) are not necessarily exact.

8. This outline conforms to JEDEC publication MS-013-AD ISSUE C.

SIDE VIEW “A”

SIDE VIEW “B”

TYPICAL RECOMMENDED LAND PATTERN

INDEX

AREA

SEATING PLANE

DETAIL "A"

x 45°

7.60 (0.299)

7.40 (0.291)

0.75 (0.029)

0.25 (0.010)

10.65 (0.419)

10.00 (0.394)

1.27 (0.050)

0.40 (0.016)

15.60 (0.614)

15.20 (0.598)

2.65 (0.104)

2.35 (0.093)

0.30 (0.012)

0.10 (0.004)

1.27 (0.050)

0.51 (0.020)

0.33 (0.013)

0.32 (0.012)

0.23 (0.009)

8°

0°

1.981 (0.078)

9.373 (0.369)

0.533 (0.021)

1.27 (0.050)

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