MCD312-12io1

Phase leg

Thyristor \ Diode Module

3

1

2

5

4

Part number

MCD312-12io1

Backside: isolated

TAV

T

V

V

1.06

RRM

320

1200

=

V

=

V

I

=

A

2x

Features / Advantages:

Applications:

Package:

●

International standard package

●

Direct copper bonded Al2O3-ceramic

with copper base plate

●

Planar passivated chip

●

Isolation voltage 3600 V~

●

Keyed gate/cathode twin pins

●

Motor control, softstarter

●

Power converter

●

Heat and temperature control for

industrial furnaces and chemical

processes

●

Lighting control

●

Solid state switches

Y1

●

Industry standard outline

●

RoHS compliant

●

Soldering pins for PCB mounting

●

Base plate: Copper

internally DCB isolated

●

Advanced power cycling

●

Isolation Voltage:

V~

3600

The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and

the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The

information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns

the specific application of your product, please contact your local sales office.

Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.

Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend

- to perform joint risk and quality assessments;

- the conclusion of quality agreements;

- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.

Terms Conditions of usage:

IXYS reserves the right to change limits, conditions and dimensions.

20170116e

Data according to IEC 60747and per semiconductor unless otherwise specified

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