NCP4545

www.onsemi.com

11

PACKAGE DIMENSIONS

QFN18, 3x3, 0.5P

CASE 485BF

ISSUE O

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

PIN 1

REFERENCE

A

B

C

0.15

TOP VIEW

D

E

C

0.15

NOTES:

1. DIMENSIONS AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND 0.30

MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

E2

BOTTOM VIEW

b

0.10

18X

L

1

5

0.05

C AB

C

D2

e

K

4

13

18X

(A3)

C

C

0.08

C

0.10

SIDE VIEW

A1

A

SEATING

PLANE

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

3.00 BSC

D2

1.75

1.95

E

3.00 BSC

E2

1.75

1.95

e

0.50 BSC

K

0.20

−−−

L

0.275

0.375

NOTE 3

L1

DETAIL A

DETAIL B

EDGE OF PACKAGE

MOLD CMPD

EXPOSED Cu

L

OPTIONAL

CONSTRUCTION

OPTIONAL

CONSTRUCTION

L1

0.00

0.15

NOTE 4

DETAIL B

3.30

18X

DIMENSION: MILLIMETERS

0.53

1.95

1.95

0.50

PITCH

18X

0.31

MOUNTING FOOTPRINT

DETAIL A

3.30

L

9

10

18

PACKAGE

OUTLINE

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

NCP4545/D

ecoSWITCH is a trademark of Semiconductor Components Industries, LLC (SCILLC).

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