SCM-i.MX 6Dual/6Quad Datasheet for Consumer Products, Data Sheet: Technical Data, Rev. 0, 02/2016

Freescale Semiconductor, Inc.

11

4. Electrical Characteristics

4.1. Chip-Level Conditions

4.1.1. Absolute Max Ratings

Table 4-1 Absolute Max Ratings

Parameter Description

Symbol

Min

Max

Unit

PMIC System Supply Voltage Range

PMIC_VIN

-0.3

4.8

V

Temperature range (storage)

T_storage

-40

150

C

4.1.2. Thermal Resistance

Table 4-2 provides the FO-WLP thermal resistance data.

Table 4-2 FO-WLP Thermal Resistance Data

Parameter Description

Test Condition

Symbol

Value

Unit

Junction to Ambient

1,6

Single-layer board (1s); natural convection

2

36.5

°C/W

Four-layer board (2s2p); natural convection

2

19.9

°C/W

Junction to Ambient

1,6

Single-layer board (1s); air flow 200ft/min

3

27.7

°C/W

Four-layer board (2s2p); air flow 200ft/min

3

16.1

°C/W

Junction to Board

1,4,6

-

6.6

°C/W

Junction to top characterization

parameter

1,5,6

-

2.9

°C/W

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

the top surface of the board near the package.

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

temperatures will vary between die according to power ratios and use case.

4.1.3. Operating Ranges

Table 4-3 Operating Ranges

Parameter Description

Symbol

Min

Max

Unit

PMIC System Supply Voltage Range

PMIC_VIN

3.6

4.5

V

SPI NOR Flash Supply Voltage Range

NVCC_EIM0_NOR

2.775

3.6

V

Junction Temperature

(standard commercial)

Tj

0

85

C