Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Oct., 2017

APX9216

www.anpec.com.tw

3

Symbol

Parameter

Typical Value

Unit

Thermal Resistance-Junction to Ambient

(Note 2)

QFN5x5-16

TSSOP-16P

78

83

QFN5x5-16

TSSOP-16P

1.6

1.5

W

Thermal Characteristics

Note 2: Mounted on a board (60x38x1.6t mm, Glass epoxy). Te Thermal Pad on the bottom package should be soldered directly

to the PCB

’s Thermal Pad area that with several thermal vias connect to ground plan, and the PCB is a 2-layer, 10mm square

area with 2oz cooper thickness.

Symbol

Parameter

Range

Unit

VCC Pin Supply Voltage Range

3 to 6

V

SET Pin Input Voltage Range

V

MIN Pin Input Voltage Range

V

Hall Input (IN+, IN-) Common-Phase Input Voltage Range

0.2 to 3

V

Ambient Temperature

-40 to 90

Junction Temperature

-40 to 125

Note 3: Refer to the typical application circuit

APX9216

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

SUPPLY CURRENT

VREG Pin Output Voltage

3.3

3.5

3.7

V

HB Pin Output Voltage

1.2

1.3

1.4

V

Rotation Mode

-

4

6

Operating Current

Lock Protection Mode

-

4

6

mA

OSCILLATOR

OSC High Level Voltage

2.1

2.3

2.5

V

OSC Low Level Voltage

0.3

0.4

0.5

V

OSC Charge Current

20

25

30

µA

OSC Discharge Current

20

25

30

µA

OSC Oscillation Frequency

20

30

40

KHz

LOCK PROTECTION

CT Pin High Level Voltage

2.75

3

3.25

V

CT Pin Low Level Voltage

0.85

1

1.15

V

CT Charge Current

1.5

2

2.5

µA

CT Discharge Current

0.15

0.2

0.25

µA

CT Charge/Discharge Current Ratio

8

10

12

-