ICS8545BGLF datasheet(11/15 Pages) IDT

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2016© Integrated Device Technology, Inc.

Revision E, January 5, 2016

8545 Datasheet

Power Considerations

This section provides information on power dissipation and junction temperature for the 8545.

Equations and example calculations are also provided.

Power Dissipation.

The total power dissipation for the 8545 is the sum of the core power plus the power dissipated in the load(s).

The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.

NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.

•

Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 50mA = 173.25mW

2. Junction Temperature.

Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The

maximum recommended junction temperature is 125°C.

The equation for Tj is as follows: Tj = JA * Pd_total + TA

Tj = Junction Temperature



JA = Junction-to-Ambient Thermal Resistance

Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)

TA = Ambient Temperature

In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming a moderate air

flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.

Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:

70°C + 0.173W * 66.6°C/W = 81.5°C. This is well below the limit of 125°C.

This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of

board (single layer or multi-layer).

Table 6. Thermal Resitance JA for 20 Lead TSSOP, Forced Convection



JA by Velocity

Linear Feet per Minute

200

500

Single-Layer PCB, JEDEC Standard Test Boards

114.5°C/W

98.0°C/W

88.0°C/W

Multi-Layer PCB, JEDEC Standard Test Boards

73.2°C/W

66.6°C/W

63.5°C/W

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