PCT2202

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 1.1 — 14 August 2015

21 of 30

NXP Semiconductors

PCT2202

13. Package outline

Fig 18. Package outline PCT2202UK (WLCSP6)

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

wlcsp6_pct2202_po

13-10-07

14-11-19

Unit

mm

max

nom

min

0.22

0.72

1.12

0.8

0.15

0.05

A

Dimensions (mm are the original dimensions)

0.287

0.257

0.19

0.69

1.09

0.4

bD

E

e

0.4

vw

0.05

0.16

0.66

1.06

y

0.272

0.125

0.095

0.110

0.41

0.35

0.38

0

scale

1 mm

PCT2202

- - -

- - -

- - -

PCT2202

WLCSP6: wafer level chip-scale package; 6 bumps; 0.69 x 1.09 x 0.38 mm (Backside coating included)

X

A

D

B

EA

detail X

2

1

C

B

A

C

y

b

A

C

B

Ø v

C

Ø w

e

ball A1

index area

ball A1

index area