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S71PL129JC0BAI9P2 Datasheet(PDF) 117 Page - SPANSION

Part # S71PL129JC0BAI9P2
Description  Stacked Multi-Chip Product (MCP) Flash Memory
PDF  149 Pages
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
Logo SPANSION - SPANSION

S71PL129JC0BAI9P2 Datasheet(HTML) 117 Page - SPANSION

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August 30, 2004 pSRAM_Type01_12_A1
pSRAM Type 1
117
Advance
Informatio n
Low Power ICC Characteristics (32M)
Address Patterns for PAR (A3= 0, A4=1) (16M)
Address Patterns for RMS (A3 = 1, A4 = 1) (16M)
Low Power ICC Characteristics (16M)
Item
Symbol
Test
Array Partition
Typ
Max
Unit
PAR Mode Standby Current IPAR
VIN = VCC or 0V,
Chip Disabled, tA= 85oC
1/4 Array
75
µA
1/2 Array
90
µA
RMS Mode Standby Current IRMSSB
VIN = VCC or 0V,
Chip Disabled, tA= 85oC
8Mb Device
75
µA
16Mb Device
90
µA
Deep Sleep Current
IZZ
VIN = VCC or 0V,
Chip in ZZ mode, tA= 85oC
10
µA
A2 A1
A0
Active Section
Address Space
Size
Density
0
1
1
One-quarter of die
00000h - 0FFFFh
256Kb x 16
4Mb
0
1
0
One-half of die
00000h - 7FFFFh
512Kb x 16
8Mb
x
0
0
Full die
00000h - FFFFFh
1Mb x 16
16Mb
1
1
1
One-quarter of die
C0000h - FFFFh
256Kb x 16
4Mb
1
1
0
One-half of die
80000h - 1FFFFFh
512Kb x 16
8Mb
A2 A1
A0
Active Section
Address Space
Size
Density
0
1
1
One-quarter of die
00000h - 0FFFFh
256Kb x 16
4Mb
0
1
0
One-half of die
00000h - 7FFFFh
512Kb x 16
8Mb
1
1
1
One-quarter of die
C0000h - FFFFFh
256Kb x 16
4Mb
1
1
0
One-half of die
80000h - FFFFFh
512Kb x 16
8Mb
Item
Symbol
Test
Array Partition
Typ
Max
Unit
PAR Mode Standby Current
IPAR
VIN = VCC or 0V,
Chip Disabled, tA= 85oC
1/4 Array
65
µA
1/2 Array
80
RMS Mode Standby Current
IRMSSB
VIN = VCC or 0V,
Chip Disabled, tA= 85oC
4Mb Device
65
µA
8Mb Device
80
Deep Sleep Current
IZZ
VIN = VCC or 0V,
Chip in ZZ# mode, tA= 85oC
10
µA



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