ICS-40310 datasheet(5/14 Pages) TDK

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ICS-40310

SOLDERING PROFILE

Figure 1. Recommended Soldering Profile Limits

TABLE 3. RECOMMENDED SOLDERING PROFILE*

PROFILE FEATURE

Sn63/Pb37

Pb-Free

Average Ramp Rate (TL to TP)

1.25°C/sec max

Preheat

Minimum Temperature

(TSMIN)

100°C

Minimum Temperature

(TSMIN)

150°C

200°C

Time (TSMIN to TSMAX), tS

60 sec to 75 sec

Ramp-Up Rate (TSMAX to TL)

1.25°C/sec

Time Maintained Above Liquidous (tL)

45 sec to 75 sec

~50 sec

Liquidous Temperature (TL)

183°C

217°C

Peak Temperature (TP)

215°C +3°C/−3°C

260°C +0°C/

−5°C

Time Within +5°C of Actual Peak

Temperature (tP)

20 sec to 30 sec

Ramp-Down Rate

3°C/sec max

Time +25°C (t25°C) to Peak Temperature

5 min max

*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones

are also compatible with the J-STD-020 profile.

t25°C TO PEAK TEMPERATURE

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

Page 5 of 14

Document Number: DS-ICS-40310-00

Revision: 1.2

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