ICS-40310

PCB DESIGN AND LAND PATTERN LAYOUT

It is recommended that the PCB land pattern for the ICS-40310 be laid out to a 1:1 ratio to the solder pads on the microphone

package, as shown in Figure 10. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil

pattern layout is shown in Figure 11. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port

of the microphone. A minimum diameter of 0.5 mm is recommended.

Figure 10. PCB Land Pattern Layout (Dimensions shown in millimeters)

Figure 11. Suggested Solder Paste Stencil Pattern Layout (Dimensions shown in millimeters)

PCB MATERIAL AND THICKNESS

The performance of the ICS-40130 is not affected by PCB thickness. The ICS-40310 can be mounted on either a rigid or flexible PCB.

A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method

offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.

Ø1.55

Ø0.95

1.52

0.90

1.90

1.22

0.68

0.61

0.61

0.61

0.225

Ø1.55

Ø1.05

45° TYP

45° TYP

0.6

0.61

0.6

0.8

0.8

1.22

1.52

Page 10 of 14

Document Number: DS-ICS-40310-00

Revision: 1.2