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GD25B64CSIG Datasheet(PDF) 30 Page - GigaDevice Semiconductor (Beijing) Inc.

Part # GD25B64CSIG
Description  3.3V Uniform Sector Dual and Quad Serial Flash
PDF  57 Pages
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Manufacturer  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Direct Link  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD25B64CSIG Datasheet(HTML) 30 Page - GigaDevice Semiconductor (Beijing) Inc.

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3.3V Uniform Sector
Dual and Quad Serial Flash
GD25B64C
30
7.20. Chip Erase (CE) (60/C7H)
The Chip Erase (CE) command is used to erase all the data of the chip. A Write Enable (WREN) command must
previously have been executed to set the Write Enable Latch (WEL) bit The Chip Erase (CE) command is executed if the
Block Protect (BP2, BP1, and BP0) bits are 0 and CMP=0 or the Block Protect (BP2, BP1, and BP0) bits are 1 and CMP=1.
The Chip Erase (CE) command is ignored if one or more sectors are protected.
The Chip Erase command sequence: CS# goes low  sending Chip Erase command  CS# goes high. The
command sequence is shown below. CS# must be driven high after the eighth bit of the command code has been latched
in; otherwise the Chip Erase command is not executed. As soon as CS# is driven high, the self-timed Chip Erase cycle
(whose duration is tCE) is initiated. While the Chip Erase cycle is in progress, the Status Register may be read to check the
value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Chip Erase cycle, and is
0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset.
The Chip Erase (CE) command is executed only if all Block Protect (BP2, BP1, and BP0) bits are 0. The Chip Erase (CE)
command is ignored if one or more sectors are protected.
Figure 23. Chip Erase Sequence Diagram
7.21.
Deep Power-Down (DP) (B9H)
Executing the Deep Power-Down (DP) command is the only way to put the device in the lowest consumption mode
(the Deep Power-Down Mode). It can also be used as an extra software protection mechanism, while the device is not in
active use, since in this mode, the device ignores all Write, Program and Erase commands. Driving CS# high deselects the
device, and puts the device in the Standby Mode (if there is no internal cycle currently in progress). But this mode is not the
Deep Power-Down Mode. The Deep Power-Down Mode can only be entered by executing the Deep Power-Down (DP)
command. Once the device has entered the Deep Power-Down Mode, all commands are ignored except the Release from
Deep Power-Down and Read Device ID (RDI) (ABH) or Enable Reset (66H) and Reset (99H) commands. These
commands can release the device from this mode. The Release from Deep Power-Down and Read Device ID (RDI)
command releases the device from deep power down mode , also allows the Device ID of the device to be output on SO.
The Deep Power-Down Mode automatically stops at Power-Down, and the device is in the Standby Mode after
Power-Up. The Deep Power-Down (DP) command is entered by driving CS# low, followed by the command code on SI.
CS# must be driven low for the entire duration of the sequence.
The Deep Power-Down command sequence: CS# goes low  sending Deep Power-Down command  CS# goes
high. The command sequence is shown below. CS# must be driven high after the eighth bit of the command code has
been latched in; otherwise the Deep Power-Down (DP) command is not executed. As soon as CS# is driven high, it
requires a delay of tDP before the supply current is reduced to ICC2 and the Deep Power-Down Mode is entered. Any Deep
Power-Down (DP) command, while an Erase, Program or Write cycle is in progress, is rejected without having any effects
on the cycle that is in progress.
Command
0
1
2
3
4
5
6
7
60H or C7H
CS#
SCLK
SI



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