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SSM3K35AFS Datasheet(PDF) 3 Page - Toshiba Semiconductor

Part # SSM3K35AFS
Description  MOSFETs Silicon N-Channel MOS
PDF  9 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM3K35AFS Datasheet(HTML) 3 Page - Toshiba Semiconductor

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SSM3K35AFS
3
5.
5.
5.
5. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
5.1.
5.1.
5.1.
5.1. Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
Forward transfer admittance
Reverse drain current (pulsed)
(Note 1)
(Note 2)
(Note 2)
(Note 2)
Symbol
IGSS
IDSS
V(BR)DSS
Vth
RDS(ON)
|Yfs|
IDRP
Test Condition
VGS = ±10 V, VDS = 0 V
VDS = 20 V, VGS = 0 V
ID = 1 mA, VGS = 0 V
VDS = 10 V, ID = 100 µA
ID = 150 mA, VGS = 4.5 V
ID = 150 mA, VGS = 2.5 V
ID = 150 mA, VGS = 1.8 V
ID = 20 mA, VGS = 1.5 V
ID = 10 mA, VGS = 1.2 V
ID = 150 mA, VGS = 4.5 V,
Tj = 125 
VDS = 10 V, ID = 150 mA
Min
20
0.35
Typ.
0.75
1.1
1.4
1.7
2.4
1.25
0.5
Max
±1
1
1.0
1.1
1.6
2.4
3.1
9.0
2.5
600
Unit
µA
V
V
S
mA
Note 1: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (100 µA for
this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 2: Pulse measurement.
5.2.
5.2.
5.2.
5.2. Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (turn-on delay time)
Switching time (rise time)
Switching time (turn-off delay time)
Switching time (fall time)
Symbol
Ciss
Crss
Coss
td(on)
tr
td(off)
tf
Test Condition
VDS = 10 V, VGS = 0 V,
f = 1 MHz
VDD = 10 V, ID = 75 mA,
VGS = 0 to 4.5 V, RG = 10 Ω
Min
Typ.
18
5
6
2
2
6.5
5.5
Max
36
10
12
Unit
pF
ns
5.3.
5.3.
5.3.
5.3. Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.1
5.3.1
5.3.1
5.3.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.2
5.3.2
5.3.2
5.3.2 Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
2017-02-17
Rev.3.0
©2016 Toshiba Corporation



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