Approval sheet

Page 7 of 8

ASC_WFxxP_J_V03

DEC 2016

TEST AND REQUIREMENTS

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp heat,

long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

REQUIREMENT

TEST

PROCEDURE / TEST METHOD

Resistor

Electrical Characteristics

JISC5201-1: 1998

Clause 4.8

Natural resistance change per change in degree

centigrade.

(

)

6

1

2

1

1

2

10

×

−

−

t

t

R

R

R

(ppm/

°C)

Within the specified tolerance

Refer to “QUICK REFERENCE

DATA”

Resistance to soldering

heat(R.S.H)

MIL-STD-202

method 210

Un-mounted chips completely immersed for 10±1second

in a SAC solder bath at

270℃±5ºC

∆R/R max. ±(1.0%+0.05Ω)

no visible damage

Solderability

J-STD-002

a) Bake the sample for 155℃ dwell time 4hrs/ solder

dipping 235℃/ 5sec.

b) Steam the sample dwell time 8 hour/ solder dipping 215

℃/ 5sec.

c) Steam the sample dwell time 8 hour/ solder dipping 260

℃/ 7sec.

95%

coverage

min.,

good

tinning and no visible damage

Temperature cycling

JESD22

Method JA-104

1000 cycles, -55℃

~ +155℃, dwell

time 30min

maximum.

∆R/R max. ±(1.0%+0.05Ω)

No visible damage

Moisture Resistance

MIL-STD-202

method 106

65

±2°C, 80~100% RH, 10 cycles, 24 hours/ cycle

∆R/R max. ±(1.0%+0.05Ω)

No visible damage

Bias Humidity

MIL-STD-202

method 103

1000+48/-0 hours; 85

°C, 85% RH, 10% of operation

power

∆R/R max. ±(2.0%+0.10Ω)

No visible damage

Operational Life

MIL-STD-202

method

108

1000+48/-0 hours; 35% of

operation power, 125

±2°C

∆R/R max. ±(2.0%+0.1Ω)

No visible damage

High Temperature Exposure

MIL-STD-202

Method 108

1000+48/-0 hours; without load

in

a temperature

chamber controlled 155

±3°C

∆R/R max. ±(2.0%+0.10Ω)

No visible damage

Board Flex

AEC-Q200-005

Resistors mounted on a 90mm glass epoxy resin

PCB(FR4),bending once 2mm for 60sec.

∆R/R max. ±(1.0%+0.05Ω)

No visible damage