WF10C1000TTL datasheet(8/10 Pages) WALSIN

8 / 10 page

Approval Sheet

Page 8 of 10

ASC_WFxxC

MAR 2018

TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

REQUIREMENT

TEST

PROCEDURE

Resistor

DC resistance

Clause 4.5

DC resistance values measured

Within the specified tolerance

Temperature

Coefficient of

Resistance(T.C.R)

Clause 4.8

Natural resistance change per change in degree

centigrade.

(

)

−

(ppm/

°C)

R1 : Resistance at reference temperature

R2 : Resistance at test temperature

t1 : 20°C+5°C-1°C

t2 : 125°C+5°C-1°C

Refer to

“ QUICK REFERENCE DATA “

Short time overload

(S.T.O.L)

Clause 4.13

Permanent

resistance

change

after

5second

application of a voltage 2.5 times RCWV or the

maximum overload voltage specified in the above list,

whichever is less.

∆R/R max. ±(0.1%+0.05Ω)

Resistance to

soldering

heat(R.S.H)

IEC 60068-2-

58:2004

Un-mounted

chips

completely

immersed

for

10±1second in a SAC solder bath at 260℃±5ºC

no visible damage

∆ R/R max. ±(0.1%+0.05Ω)

Solderability

IEC 60068-2-

58:2004

Un-mounted chips completely immersed for 2±0.5

second in a SAC solder bath at 235℃±5℃

good tinning (>95% covered)

no visible damage

Temperature

cycling

Clause 4.19

30 minutes at -55

°C±3°C, 2~3 minutes at 20°C+5°C-

1°C, 30 minutes at +155

°C±3°C, 2~3 minutes at

20°C+5°C-1°C, total 5 continuous cycles

no visible damage

∆R/R max. ±(0.25%+0.05Ω)

Load Life

(Endurance)

Clause 4.25

70±2ºC, 1000 hours, loaded with RCWV or Vmax,1.5

hours on and 0.5 hours off

∆R/R max. ±(0.25%+0.05Ω)

Humidity

Clause 4.24

1000 hours, at rated continuous working voltage in

humidity chamber controller at 40

°C±2°C and 90~95%

relative humidity, 1.5hours on and 0.5 hours off

∆R/R max. ±(0.25%+0.05Ω)

Bending strength

Clause 4.33

Resistors mounted on a 90mm glass epoxy resin

PCB(FR4); bending : 3 mm, once for 10 seconds.

∆R/R max. ±(0.1%+0.05Ω)

Adhesion

Clause 4.32

Pressurizing force: 5N, Test time: 10±1sec.

No remarkable damage or removal of the

terminations.

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