Data Sheet S15417EJ2V0DS

21

µµµµPD3728DZ

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below.

If other soldering processes are used, or if the soldering is performed under different conditions, please make sure

to consult with our sales offices.

Type of Through-hole Device

µµµµPD3728DZ : CCD linear image sensor 36-pin ceramic DIP (CERDIP) (15.24 mm (600))

Process

Conditions

Partial heating method

Pin temperature : 300

°C or below, Heat time : 3 seconds or less (per pin)

Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the glass cap.

The optical characteristics could be degraded by such contact.

2. Soldering by the solder flow method may have deleterious effects on prevention of glass cap

soiling and heat resistance. So the method cannot be guaranteed.