eGaN® FET DATASHEET

EPC – THE LEADER IN GaN TECHNOLOGY | WWW.EPC-CO.COM | COPYRIGHT 2019 |

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EPC2021

RECOMMENDED

LAND PATTERN

(units in µm)

RECOMMENDED

STENCIL DRAWING

(units in µm)

1

3

5

7

9

11

13

15

17

19

21

23

25

27

29

6050

180

400

X30

X28

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

6050

400

X34

200

X35

R60

1

3

5

7

9

11

13

15

17

19

21

23

25

27

29

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

Information subject to

change without notice.

Revised August, 2019

Recommended stencil should be 4 mil

(100 µm) thick, must be laser cut, openings

per drawing.

Intended for use with SAC305 Type 3 solder,

reference 88.5% metals content.

Additional assembly resources available at

https://epc-co.com/epc/DesignSupport/

AssemblyBasics.aspx

Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to

improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights, nor the rights of others.

eGaN® is a registered trademark of Efficient Power Conversion Corporation.

EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx

Land pattern is solder mask defined

Solder mask opening is 180 µm

It is recommended to have on-Cu trace PCB vias

Pad 1 is Gate;

Pads 2, 5, 6, 9,10,13,14, 17, 18, 21, 22,

25, 26, 29 are Source;

Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23,

24, 27, 28 are Drain;

Pad 30 is Substrate.*

*Substrate pin should be connected to Source