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RB520CS3002L Datasheet(PDF) 3 Page - Nexperia B.V. All rights reserved

Part # RB520CS3002L
Description  200 mA low VF MEGA Schottky barrier rectifier
PDF  13 Pages
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Manufacturer  NEXPERIA [Nexperia B.V. All rights reserved]
Direct Link  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

RB520CS3002L Datasheet(HTML) 3 Page - Nexperia B.V. All rights reserved

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© Nexperia B.V. 2017. All rights reserved
Nexperia
RB520CS3002L
200 mA low VF MEGA Schottky barrier rectifier
RB520CS3002L
All information provided in this document is subject to legal disclaimers.
Product data sheet
25 June 2013
3 / 13
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
-
30
V
δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;
square wave
[1]
-
200
mA
IF(AV)
average forward current
δ = 0.5 ; f = 20 kHz; Tsp ≤ 135 °C;
square wave
-
200
mA
IFSM
non-repetitive peak forward
current
tp = 8.3 ms; Tj(init) = 25 °C; half sine
wave
-
3
A
[2]
-
315
mW
[1]
-
565
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[3]
-
865
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1][2]
-
-
395
K/W
[1][3]
-
-
220
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[1][4]
-
-
145
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
[5]
-
-
70
K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5] Soldering point of cathode tab.



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