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97SD3232 Datasheet(PDF) 19 Page - Maxwell Technologies

Part # 97SD3232
Description  1 Gb SDRAM 8-Meg X 32 Bit X 4-Banks
PDF  39 Pages
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Manufacturer  MAXWELL [Maxwell Technologies]
Direct Link  http://www.maxwell.com
Logo MAXWELL - Maxwell Technologies

97SD3232 Datasheet(HTML) 19 Page - Maxwell Technologies

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97SD3232
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All data sheets are subject to change without notice
©2005 Maxwell Technologies
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1 Gb (8-Meg X 32-Bit X 4-Banks) SDRAM
01.11.05 Rev 2
Operation of the SDRAM
The following section shows operation examples of 97SD3232.
Note: The SDRAM should be used according to the product capability ( See Pin Description and AC
Characteristics.)
Read/Write Operations:
Bank Active: Before executing a read or write operation, the corresponding bank and the row address must
be activated by the bank active (ACTV) command. An interval of t
RCD is required between the bank active
command input and the following read/write command input.
Read operation: A read operation starts when a read command is input. The output buffer becomes Low-Z
in the (CAS latency - 1) cycle after read command set. The SDRAM can perform a burst read operation.
The burst length can be set to 1, 2, 4, or 8. The start address for a burst read is specified by the column
address and the bank select address (BA0/BA1) at the read command set cycle. In a read operation, data
output starts after the number of clocks specified by the CAS latency. The CAS latency can be set to 2 or 3.
When the burst length is 1, 2, 4, or 8, the D
OUT buffer automatically becomes High-Z at the next clock after
the successive burst-length data has been output.
The CAS latency and burst length must be specified at the mode register.



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