AWR2243_V01 datasheet(21/62 Pages) TI

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Available HPF Corner Frequencies (kHz)

HPF1

HPF2

175,235,350,700

350, 700, 1400, 2800

The filtering performed by the digital baseband chain is targeted to provide:

•

Less than ±0.5 dB pass-band ripple/droop, and

•

Better than 60 dB anti-aliasing attenuation for any frequency that can alias back into the pass-band.

(3)

The max ramp rate depends on the PLL bandwidth configuration set using the"AWR_APLL_SYNTH_BW_CONTROL_SB" API. For

more details, see the mmWave radar Interface Control Users Guide.

(4)

The phase noise numbers use the following configuration: SYNTH ICP TRIM = 3 , SYNTH RZ TRIM = 8 , and APLL ICP TRIM = 0x26.

(5)

Cascading Feature is available in AWR2243P variant.

(6)

At 140°C TJ, the max input level recommended is 3 dBm

Figure 8-1 shows variations of noise figure and in-band P1dB parameters with respect to receiver gain

programmed.

Rx Gain (dB)

-42

-39

-36

-33

-30

-27

-24

-21

-18

D001

NF (dB)

P1dB (dBm)

Figure 8-1. Noise Figure, In-band P1dB vs Receiver Gain

8.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]

THERMAL METRICS(1)

°C/W(2) (3)

RΘJC

Junction-to-case

RΘJB

Junction-to-board

5.9

RΘJA

Junction-to-free air

21.6

RΘJMA

Junction-to-moving air

15.3(4)

PsiJT

Junction-to-package top

0.69

PsiJB

Junction-to-board

5.8

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2)

°C/W = degrees Celsius per watt.

(3)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/

JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(4)

Air flow = 1 m/s

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AWR2243

SWRS223A – FEBRUARY 2020 – REVISED AUGUST 2020

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