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VD6640 Datasheet(PDF) 88 Page - STMicroelectronics

Part # VD6640
Description  Automotive 1.3 megapixel high-dynamic range image sensor
PDF  126 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

VD6640 Datasheet(HTML) 88 Page - STMicroelectronics

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Electrical characteristics
VG6640, VD6640
88/126
DocID023597 Rev 11
Caution:
Stresses above those listed under “Absolute maximum ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of the
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
9.3
Operating conditions
Table 41. Operating conditions
Symbol
C
Parameter
Minimum
Typical
Maximum
Unit
VCORE
C
Digital core power supply
1.08
1.2
1.32
V
VDIG
C
Digital I/O power supply
1.62
1.8
1.92
V
VANA
C
Analog power supply
2.66
2.8
2.94
V
VIP
C
Digital input voltage(1)
1. Digital input: EXTCLK_XTAL1, EXTCLK_EN, XSHUTDOWN, RESET_N, FSYNC_IN, GPIO, SCL, SDA.
-0.3
2.3
V
TJF
C
Junction temperature (operating
functionally)
-40
+125
°C
TJN
PA
Junction temperature (operating
normally and producing acceptable
images)
-40
+105
°C
TAO
T
Ambient temperature (operating
optimally)
+5
+40
°C
TATR
PA
Ambient room temperature during
test(2)
2. 100% tested parameters are measured at this temperature.
+20
+30
°C
TATH
PA
Ambient high temperature during
wafer test(3)
3. A subset of parameters are measured at this temperature.
+103
+105
°C
P
Ambient high temperature during
wafer test(3)
+58
+60
TATL
PA
Ambient low temperature during
wafer test(3)
-40
-38
°C
θJA-F
D
Junction to ambient thermal
resistance for device attached to a
PCB in free air
50
°C/W
θJA-H
D
Junction to ambient thermal
resistance for device attached to a
PCB on an infinite heatsink
23
°C/W



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