DS13039 Rev 1

31/36

STSAFE-A110

Package information

35

6.2

UFDFPN8 package information

The UFDFPN8 package is an 8-lead, 2 × 3 mm, 0.5 mm pitch, ultra thin profile fine pitch

dual flat package.

Figure 18. UFDFPN8 – package outline

1. Max. package warpage is 0.05 mm.

2. Exposed copper is not systematic and can appear partially or totally according to the cross section.

3. Drawing is not to scale.