The name and content of poisonous and harmful material in products

Hazardous Substance

Part’s Name

Pb

Hg

Cd

Cr(VI)

PBB

PBDE

Limit

≤

0.1%

≤

0.1%

≤

0.01%

≤

0.1%

≤

0.1%

≤

0.1%

Lead Frame

○

○

○

○

○

○

Molding Compound

○

○

○

○

○

○

Chip

○

○

○

○

○

○

Wire Bonding

○

○

○

○

○

○

Solder

×

○

○

○

○

○

Note

○：

means the hazardous material is under the criterion of SJ/T11363-2006.

×：

means the hazardous material exceeds the criterion of SJ/T11363-2006.

Warnings

1. Exceeding the maximun ratings of the device in performance may cause damage to the device,

even the permanent failure, which may affect the dependability of the machine. It is suggested

to be used under 80 percent of the maximun ratings of the device.

2. When installing the heatsink, please pay attention to the torsional moment and the smoothness

of the heatsink.

3. VDMOSFETs is the device which is sensitive to the static electricity, it is necessory to protect

the device from being damaged by the static electricity when using it.

4. This publication is made by H&M Semiconductor and subject to regular change without

notice.

20N60