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HMC524ALC3BTR-R5 Datasheet(PDF) 1 Page - Analog Devices |
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HMC524ALC3BTR-R5 Datasheet(HTML) 1 Page - Analog Devices |
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1 / 24 page ![]() 22 GHz to 32 GHz, GaAs, MMIC, I/Q Mixer Data Sheet HMC524ALC3B Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibilityisassumedbyAnalogDevicesforitsuse,norforanyinfringementsofpatentsorother rightsofthirdpartiesthatmayresultfromitsuse.Specificationssubjecttochangewithoutnotice.No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com FEATURES Passive: no dc bias required Conversion loss: 9 dB (typical) Image rejection: 20 dB (typical) LO to RF isolation: 35 dB (typical) LO to IF isolation: 25 dB (typical) IP3: 18 dBm (typical) P1dB: 17 dBm (typical) IF pin frequency: dc − 4.5 GHz 12-lead, 3 mm × 3 mm SMT ceramic package APPLICATIONS Point to point radios Point to multipoint radios and VSAT Test equipment and sensors Military end use FUNCTIONAL BLOCK DIAGRAM PACKAGE BASE GND 90°HYBRID HMC524ALC3B 1 GND 7 GND 8 GND 9 LO 10 11 12 4 2 RF 3 GND 5 6 Figure 1. GENERAL DESCRIPTION The HMC524ALC3B is a compact gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), in phase quadrature (I/Q) mixer in a leadless RoHS compliant surface- mount (SMT) ceramic package. This device can be used as either an image reject mixer or a single-sideband upconverter. The mixer uses two standard, double balanced mixer cells and a 90° hybrid coupler fabricated in a GaAs, metal–semiconductor field effect transistor (MESFET) process. A low frequency quadrature hybrid produces a 100 MHz IF output. This device is a much smaller alternative to hybrid style image reject mixers and single-sideband upconverter assemblies. The HMC524ALC3B eliminates the need for wire bonding, allowing use of surface-mount manufacturing techniques. |
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