PD70224 datasheet(22/25 Pages) MICROCHIP

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Revision History

Revision

Date

Description

October 2020

Updated a typo for a value of K in the Package Measurements table.

September 2020

The following is a summary of changes in revision C of this document.

• Updated the Introduction section.

• Added Technical Support and Documentation section.

• Updated the values of K in the Package Measurements table.

• Updated the Internal Construction and Pinout figure.

• Updated the 4.3 Recommended PCB Layout section.

• Updated the PD70224 EVB PCB Silk Top figure.

• Updated the Ordering Information table.

July 2020

• Updated to Microchip format.

• Updated document number from PD-000307871 to DS00003590.

• Deleted figure "PD70224 Bottom Layer Copper and Solder Paste

Recommended PCB Layout for Thermal Pad Array (mm)" in the

Recommended PCB Layout section.

3.0

August 2019

Updated the package marking in the Ordering Information section.

2.0

February 2018

• Updated part marking.

• Updated figure External Power Input Connected to PD70210A Output.

• Added MSL3 compliance.

• Updated Safe Operating Area graph to show test methodology and

discuss protection recommendations.

• Moved Recommended Protection Scheme to the application note “Design

for PD System Surge Immunity".

1.3

May 2016

Updated Figure 7 with optional slow start circuit.

1.2

November 2014

• Removed watermark.

• Updated ESD with IN1A/IN2A 1000 V note.

1.1

July 2015

Updated ESD.

1.0

August 2014

• Added maximum SUPP_Sx current, application information, and SOA

graph.

• Updated MSL level.

0.73

June 2014

Updated leadframe for thermal pad.

0.72

May 2014

Added dimensions to recommended layout IMAX_LOAD.

0.7

May 2014

Initial Revision

PD70224

Revision History

Datasheet

DS00003575C-page 22

PD70224 Datasheet(PDF) 22 Page - Microchip Technology

PD70224 Datasheet(HTML) 22 Page - Microchip Technology

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