DRAWING NO.

REV.

TITLE

GPC

4U-13

A

10/1/15

4U-13, 4-ball 2x2 Array, 0.40mm Pitch

Wafer Level Chip Scale Package (WLCSP) with BSC

GUJ

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

TYP

MAX

NOTE

A

0.260

0.295

0.330

A1

—

0.070

—

A2

—

0.225

—

3

D

Contact Microchip for Details

d1

0.400 BSC

E

Contact Microchip for Details

e1

0.400 BSC

b

—

0.162

—

PIN ASSIGNMENT MATRIX

BOTTOM VIEW

TOP VIEW

SIDE VIEW

1

2

A

B

V

CC

SDA

GND

SCL

d1

e1

E

D

b (4X)

A2

A1

A

v

d

0.015

C

d

0.05

C A B

A1 CORNER

A1 CORNER

SEATING PLANE

B

A

2

1

B

A

1

2

d

m

m

Note: 1. Dimensions are NOT to scale.

2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.

3. Product offered with Back Side Coating (BSC)

B

A

C

Note:  For the most current package drawings, please see the Microchip Packaging Specification located at http://

www.microchip.com/packaging.

AT24CSW01X/AT24CSW02X

Packaging Information

and its subsidiaries

Datasheet

DS20006396B-page 35