40

SLDN-40E1A

tech.support@psbel.com

The SLDN-40E1Ax power modules operate in a variety of thermal environments; however, sufficient cooling should always be

provided to help ensure reliable operation.

Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction

in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on

physical measurements taken in a wind tunnel. The test set-up is shown in Figure 30. The preferred airflow direction for the module

is in Figure 31.

Figure 30. Thermal Test Setup

The thermal reference points, Tref used in the specifications are also shown in Figure 30. For reliable operation the temperatures at

these points should not exceed 120°C. The output power of the module should not exceed the rated power of the module (Vo,set x

Io,max).

Please refer to the Application Note “Thermal Characterization Process for Open-Frame Board-Mounted Power Modules” for a detailed

discussion of thermal aspects including maximum device temperatures.

Figure 31. Preferred airflow direction and location of hot spot of the module (Tref)

Air

flow

x

Power Module

Wind Tunnel

PWBs

12.7_

(0.50)

76.2_

(3.0)

Probe Location

for measuring

airflow and

ambient

temperature

25.4_

(1.0)