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ICS556M-04ILF Datasheet(PDF) 5 Page - Integrated Circuit Systems

Part # ICS556M-04ILF
Description  LOW SKEW 1 TO 4 CLOCK BUFFER
PDF  6 Pages
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Manufacturer  ICST [Integrated Circuit Systems]
Direct Link  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS556M-04ILF Datasheet(HTML) 5 Page - Integrated Circuit Systems

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LOW SKEW 1 TO 4 CLOCK BUFFER
MDS 556-04 C
5
Revision 030905
In te gr ated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 ● tel (4 08) 297-1 201 ● www.icst.com
ICS556-04
AC Electrical Characteristics
VDD = 2.5 V ±5%, Ambient Temperature -40 to +85
°C, unless stated otherwise
VDD = 3.3 V ±5%, Ambient Temperature -40 to +85
°C, unless stated otherwise
VDD = 5 V ±5%, Ambient Temperature -40 to +85
°C, unless stated otherwise
Notes: 1. Between any two outputs with equal loading.
Thermal Characteristics
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
5
27
MHz
Output Rise Time
tOR
0.8 to 2.0 V, CL=15 pF
1.8
2.5
ns
Output Fall Time
tOF
2.0 to 0.8 V, CL=15 pF
1.8
2.5
ns
Output to output skew
Note 1
Rising edges at VDD/2
0
50
ps
Duty Cycle
Measured at VDD/2
45
50
55
%
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
5
27
MHz
Output Rise Time
tOR
0.8 to 2.0 V, CL=15 pF
0.6
1.0
ns
Output Fall Time
tOF
2.0 to 0.8 V, CL=15 pF
0.6
1.0
ns
Output to output skew
Note 1
Rising edges at VDD/2
0
50
ps
Duty Cycle
Measured at VDD/2
45
50
55
%
Phase Noise at 1MHz from
carrier
-125
dBc/Hz
Clock Jitter RMS 1KHz to 1MHz
6
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
5
27
MHz
Output Rise Time
tOR
0.8 to 2.0 V, CL=15 pF
0.3
0.7
ns
Output Fall Time
tOF
2.0 to 0.8 V, CL=15 pF
0.3
0.7
ns
Output to output skew
Note 1
Rising edges at VDD/2
0
50
ps
Duty Cycle
Measured at VDD/2
45
50
55
%
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air
150
°C/W
θ
JA
1 m/s air flow
140
°C/W
θ
JA
3 m/s air flow
120
°C/W
Thermal Resistance Junction to Case
θ
JC
40
°C/W



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