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ICS556M-04ILF Datasheet(PDF) 6 Page - Integrated Circuit Systems

Part # ICS556M-04ILF
Description  LOW SKEW 1 TO 4 CLOCK BUFFER
PDF  6 Pages
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Manufacturer  ICST [Integrated Circuit Systems]
Direct Link  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS556M-04ILF Datasheet(HTML) 6 Page - Integrated Circuit Systems

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LOW SKEW 1 TO 4 CLOCK BUFFER
MDS 556-04 C
6
Revision 030905
In te gr ated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 ● tel (4 08) 297-1 201 ● www.icst.com
ICS556-04
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Ordering Information
“LF” denotes Pb free package.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
ICS556M-04I
556M-04I
Tubes
8-pin SOIC
-40 to +85
°C
ICS556M-04IT
556M-04I
Tape and Reel
8-pin SOIC
-40 to +85
°C
ICS556M-04ILF
556M04IL
Tubes
8-pin SOIC
-40 to +85
°C
ICS556M-04ILFT
556M04IL
Tape and Reel
8-pin SOIC
-40 to +85
°C
INDEX
AREA
1 2
8
D
E
SEATING
PLANE
A1
A
e
- C -
B
.10 (.004)
C
C
L
H
h x 45
Millimeters
Inches
Symbol
Min
Max
Min
Max
A
1.35
1.75
.0532
.0688
A1
0.10
0.25
.0040
.0098
B
0.33
0.51
.013
.020
C
0.19
0.25
.0075
.0098
D
4.80
5.00
.1890
.1968
E
3.80
4.00
.1497
.1574
e
1.27 BASIC
0.050 BASIC
H
5.80
6.20
.2284
.2440
h
0.25
0.50
.010
.020
L
0.40
1.27
.016
.050
α
0
°
8
°
0
°
8
°



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