SS24FL-SS210FL

Surface Mount Schottky Barrier Rectifier

Document No.: F218331

08-NOV-2021 V 2.1

www.futurewafer.com.tw

FQE-001-04

2/9

2. Contents

1. Synopsis.............................................................................................................................................. 1

1-1. General Description ................................................................................................................. 1

1-2. Feature List ............................................................................................................................... 1

1-3. Applications............................................................................................................................... 1

1-4. Benefits...................................................................................................................................... 1

1-5. Mechanical Characteristics ..................................................................................................... 1

2. Contents .............................................................................................................................................. 2

3. Electrical Property............................................................................................................................. 3

3-1. Absolute Maximum Ratings .................................................................................................... 3

3-2. Electrical Characteristics (TA=25°C) ........................................................................................... 3

3-3. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)................................................ 4

4. Soldering Parameters....................................................................................................................... 5

5. Package Information......................................................................................................................... 6

5-1. Dimension ................................................................................................................................. 6

5-2. PCB Pad Layout Recommendation ....................................................................................... 6

6. Packing ................................................................................................................................................ 7

6-1. Taping and Reel Specification................................................................................................ 7

6-2. Embossed Carrier Tape Specification ................................................................................... 7

6-3. Surface Mount Reel Specification .......................................................................................... 8

6-4. Tape Leader and Trailer Specification................................................................................... 8

7. Ordering Information ........................................................................................................................ 9

8. Version................................................................................................................................................. 9

8-1. History........................................................................................................................................ 9

8-2. Company Profile....................................................................................................................... 9