MPC8560CPX667JC datasheet(85/108 Pages) NXP

Part #	MPC8560CPX667JC

Description	Integrated Processor Hardware Specifications

PDF	108 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

Logo

85 / 108 page

MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2

Freescale Semiconductor

Thermal

Figure 52. MPC8560 Thermal Model

16.2.2 Internal Package Conduction Resistance

For the packaging technology, shown in Table 60, the intrinsic internal conduction thermal resistance paths

are as follows:

•

The die junction-to-case thermal resistance

•

The die junction-to-board thermal resistance

Die

Lid

Substrate and solder balls

Heat Source

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity

Value

Unit

Lid

(12

× 14 × 1 mm)

360

W/(m

× K)

360

Lid Adhesive—Collapsed resistance

(10

× 12 × 0.050 mm)

Die

(10

× 12 × 0.76 mm)

Bump/Underfill—Collapsed resistance

(10

× 12 × 0.070 mm)

0.6

1.9

Substrate and Solder Balls

(29

× 29 × 1.47 mm)

10.2

1.6

Adhesive

Bump/underfill

MPC8560CPX667JC Datasheet(PDF) 85 Page - NXP Semiconductors

MPC8560CPX667JC Datasheet(HTML) 85 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL