STM32H750VB datasheet(98/335 Pages) STMICROELECTRONICS

98 / 335 page

Electrical characteristics (rev Y)

STM32H750VB STM32H750ZB STM32H750IB STM32H750XB

98/334

DS12556 Rev 5

6.3

Operating conditions

6.3.1

General operating conditions

Table 22. General operating conditions

Symbol

Parameter

Operating conditions

Min

Max

Unit

VDD

Standard operating voltage

1.62(1)

3.6

VDDLDO

Supply voltage for the internal regulator

VDDLDO ≤ VDD

1.62(1)

3.6

VDD33USB Standard operating voltage, USB domain

USB used

3.0

3.6

USB not used

3.6

VDDA

Analog operating voltage

ADC or COMP used

1.62

3.6

DAC used

1.8

OPAMP used

2.0

VREFBUF used

1.8

ADC, DAC, OPAMP,

COMP, VREFBUF not

used

VIN

I/O Input voltage

TT_xx I/O

−0.3

VDD+0.3

BOOT0

All I/O except BOOT0

and TT_xx

−0.3

Min(VDD, VDDA,

VDD33USB)+3.6V

< 5.5V(2)(3)

Ambient temperature for

the suffix 6 version

Maximum power dissipation

–40

°C

Low-power dissipation(4)

–40

105

Junction temperature

range

Suffix 6 version

–40

125

°C

1. When RESET is released functionality is guaranteed down to VBOR0 min

2. This formula has to be applied on power supplies related to the IO structure described by the pin definition table.

3. For operation with voltage higher than Min (VDD, VDDA, VDD33USB) +0.3V, the internal Pull-up and Pull-Down resistors must

be disabled.

4. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 8.6:

Thermal characteristics).

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