STM32H750VB datasheet(233/335 Pages) STMICROELECTRONICS

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DS12556 Rev 5

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STM32H750VB STM32H750ZB STM32H750IB STM32H750XB

Electrical characteristics (rev V)

311

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:



Corrupted program counter



Unexpected reset



Critical Data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device are monitored while a simple application,

executing EEMBC code, is running. This emission test is compliant with SAE IEC61967-2

standard which specifies the test board and the pin loading.

Table 151. EMI characteristics

Symbol Parameter

Conditions

Monitored

frequency band

Max vs.

[fHSE/fCPU]

Unit

8/400 MHz

SEMI

Peak level

VDD = 3.6 V, TA = 25 °C, UFBGA240 package,

conforming to IEC61967-2

0.1 to 30 MHz

dBµV

30 to 130 MHz

130 MHz to 1 GHz

1 GHz to 2 GHz

EMI Level

2.5

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