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STM32H750VB Datasheet(PDF) 325 Page - STMicroelectronics |
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STM32H750VB Datasheet(HTML) 325 Page - STMicroelectronics |
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325 / 335 page ![]() Package information STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 324/334 DS12556 Rev 5 Figure 126. UFBGA176+25 package recommended footprint eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 219. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 218. UFBGA176+25 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A0E7_FP_V1 Dpad Dsm |
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