BAS40WD Series

Surface Mount Switching Diode

2

Document No.: F21837W

30-DEC-2021 V 2.0

www.futurewafer.com.tw

FQE-001-04

2. Contents

1. Synopsis........................................................................................................................................................1

1-1. Feature List................................................................................................................................................1

1-2. Applications ...............................................................................................................................................1

1-3. Mechanical Characteristics .......................................................................................................................1

1-4. Absolute Maximum Ratings.......................................................................................................................1

2. Contents ........................................................................................................................................................2

3. Electrical Property........................................................................................................................................3

3-1. Electrical Characteristics ...........................................................................................................................3

3-2. Ratings and Characteristics Curve............................................................................................................3

4. Soldering Parameters ..................................................................................................................................4

5. Package Information ....................................................................................................................................5

5-1. Dimension-SOD323 ..................................................................................................................................5

5-2. PCB Pad Layout Recommendation-SOD323 ...........................................................................................5

5-3. Dimension-SOD323FL ..............................................................................................................................6

5-4. PCB Pad Layout Recommendation-SOD323FL .......................................................................................6

5-5. Dimension-SOD523FL ..............................................................................................................................7

5-6. PCB Pad Layout Recommendation-SOD523FL .......................................................................................7

6. Packing ..........................................................................................................................................................8

6-1. Taping and Reel Specification-SOD323 & SOD323FL.............................................................................8

6-2. Embossed Carrier Tape Specification-SOD323 & SOD323FL .................................................................8

6-3. Taping and Reel Specification-SOD523FL ...............................................................................................9

6-4. Embossed Carrier Tape Specification-SOD523FL ...................................................................................9

6-5. Surface Mount Reel Specification ...........................................................................................................10

6-6. Tape Leader and Trailer Specification ....................................................................................................10

7. Ordering Information..................................................................................................................................11

8. Version.........................................................................................................................................................11

8-1. History .....................................................................................................................................................11

8-2. Company Profile......................................................................................................................................11