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Document No.: F21837G

27-DEC-2021 V 2.0

www.futurewafer.com.tw

FQE-001-04

BAS70 Series

Surface Mount Switching Diode

6-1. Taping and Reel Specification-SOT23 & SOT323

6-2. Embossed Carrier Tape Specification-SOT23 & SOT323

6. Packing

Dimension W

D

D1

E

F

P

P0

P2

t

W

Value

8

mm

1.5

±0.1

1.3

Max.

1.75

±0.1

3.5

±0.05

4

±0.1

4

±0.1

2

±0.1

0.4

Max.

8

±0.3

A0 /

B0 /

K0

Determined by Component Size. The Clearance Between The Component And The Cavity Must

Comply to The Rotational and Lateral Movement Requirement Provided in Figures in The “Maximum

Component Movement in Tape Pocket” Section.

Unit: mm

Taping Width

Tape Orientation

8mm

Direction Of Feed