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STM32L053C8 Datasheet(PDF) 119 Page - STMicroelectronics |
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STM32L053C8 Datasheet(HTML) 119 Page - STMicroelectronics |
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119 / 136 page  DS10152 Rev 9 119/136 STM32L053x6 STM32L053x8 Package information 129 Figure 41. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball ,grid array recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 82. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 1.125 mm Pad trace width 0.100 mm Table 81. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball grid array package outline (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max R8_FP_V1 Dpad Dsm |
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