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STM32F051X4 Datasheet(PDF) 112 Page - STMicroelectronics |
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STM32F051X4 Datasheet(HTML) 112 Page - STMicroelectronics |
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112 / 122 page  Package information STM32F051x4 STM32F051x6 STM32F051x8 112/122 DocID022265 Rev 7 7.8 Thermal characteristics The maximum chip junction temperature (TJmax) must never exceed the values given in Table 20: General operating conditions . The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max x ΘJA) Where: • TA max is the maximum ambient temperature in °C, • ΘJA is the package junction-to-ambient thermal resistance, in °C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. 7.8.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org 7.8.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Section 8: Ordering information. Table 74. Package thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient LQFP64 - 10 × 10 mm / 0.5 mm pitch 45 °C/W Thermal resistance junction-ambient LQFP48 - 7 × 7 mm 55 Thermal resistance junction-ambient LQFP32 - 7 × 7 mm 56 Thermal resistance junction-ambient UFBGA64 - 5 × 5 mm 65 Thermal resistance junction-ambient UFQFPN48 - 7 × 7 mm 32 Thermal resistance junction-ambient UFQFPN32 - 5 × 5 mm 38 Thermal resistance junction-ambient WLCSP36 - 2.6 × 2.7 mm 60 |
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