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STM32L051C6 Datasheet(PDF) 113 Page - STMicroelectronics |
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STM32L051C6 Datasheet(HTML) 113 Page - STMicroelectronics |
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113 / 133 page ![]() DS10184 Rev 10 113/133 STM32L051x6 STM32L051x8 Package information 125 Figure 49. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale recommended footprint F- 0.305(3) - - 0.012 - G- 0.440(3) - - 0.017 - aaa - - 0.100 - - 0.004 bbb - - 0.100 - - 0.004 ccc - - 0.100 - - 0.004 ddd - - 0.050 - - 0.002 eee - - 0.050 - - 0.002 1. Values in inches are converted from mm and rounded to the 3rd decimal place. 2. Nominal dimension rounded to the 3rd decimal place results from process capability. 3. Calculated dimensions are rounded to the 3rd decimal place. Table 77. Standard WLCSP36 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed Table 76. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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