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STM32L051C6 Datasheet(PDF) 116 Page - STMicroelectronics |
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STM32L051C6 Datasheet(HTML) 116 Page - STMicroelectronics |
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116 / 133 page ![]() Package information STM32L051x6 STM32L051x8 116/133 DS10184 Rev 10 Figure 52. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package recommended footprint Table 78. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to the 3rd decimal place. Min Typ Max Min Typ Max A - - 0.33 - - 0.013 A1 - 0.10 - - 0.004 - A2 - 0.20 - - 0.008 - A3 - 0.025(2) 2. Back side coating. Nominal dimension rounded to the 3rd decimal place results from process capability. -- 0.001 - b 0.16 0.19 0.22 0.006 0.007 0.009 D 2.59 2.61 2.63 0.102 0.103 0.104 E 2.86 2.88 2.90 0.112 0.113 0.114 e - 0.40 - - 0.016 - e1 - 2.00 - - 0.079 - e2 - 2.00 - - 0.079 - F - 0.305(3) 3. Calculated dimensions are rounded to 3rd decimal place. -- 0.012 - G - 0.440(3) -- 0.017 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 |
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