ST25R3918 datasheet(137/141 Pages) STMICROELECTRONICS

137 / 141 page

DS13490 Rev 2

137/141

ST25R3918

Package information

140

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at www.st.com.

ECOPACK is an ST trademark.

6.1

VFQFPN32 package information

VFQFPN32 is a 32-pin, 5x5 mm, 0.5 mm pitch, very thin fine pitch quad flat no lead

package.

Figure 32. VFQFPN32 outline

1. Drawing is not to scale.

2. Coplanarity applies to the exposed pad as well as the terminal.

Table 124. VFQFPN32 mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.800

0.900

1.000

0.0315

0.0354

0.0394

0.050

0.0020

0.200

0.0079

0.300

0.400

0.500

0.0118

0.0157

0.0197

0.180

0.250

0.300

0.0071

0.0098

0.0118

ccc C

B04R_ME_V1

Pin #1 ID

Chamfer 0.35

bbb M C A B

32x

Pin #1 ID

32x

eee C

Detail A

BOTTOM VIEW

TOP VIEW

0.05 Ref.

SLP1 PLATED AREA

Terminal length

Terminal thickness

Detail A

SIDE VIEW

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