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STM32G041C6 Datasheet(PDF) 98 Page - STMicroelectronics |
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STM32G041C6 Datasheet(HTML) 98 Page - STMicroelectronics |
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98 / 121 page ![]() Package information STM32G041x6/x8 98/121 DS12993 Rev 3 6.2 WLCSP18 package information This WLCSP is a 18 ball, 1.86 x 2.14 mm, 0.4 mm pitch, wafer level chip scale package. Figure 35. WLCSP18 - Outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. F G e1 A1 BALL LOCATION e2 E e e D aaa (4x) BOTTOM VIEW BUMP A1 A2 A DETAIL A bbb Z SIDE VIEW Z b (36x) ccc X ZY ccc Z ccc Z A3 FRONT VIEW DETAIL A ROTATED 90 SEATING PLANE B06E_WLCSP18_DIE466_ME_V1 1 3 5 72 4 6 A B C D E TOP VIEW |
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