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SCY99080CDWR2G Datasheet(PDF) 25 Page - ON Semiconductor |
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SCY99080CDWR2G Datasheet(HTML) 25 Page - ON Semiconductor |
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25 / 27 page ![]() DDA002C http://onsemi.com 25 Level Shifter Pulse Trigger S R Q UV Detect Hgd HB Boot B A DELAY Lgd Gnd Vcc from EN2 Figure 57. The Internal Lgd and Hgd Driver Section of the DDA002C Q from latch high if OK Vaux DBOOT CBOOT VBULK The A and B outputs are delivered by the internal logic, as depicted in VCO block diagram. This logic is constructed in such a way that the Lgd driver starts to pulse first after any controller restart. The bootstrap capacitor is thus charged during first pulse. A delay is included in the lower rail to ensure good matching between these propagating signals. As stated in the maximum rating section, the floating portion can go up to 600 VDC and makes the IC perfectly suitable for offline applications featuring a 400 V PFC front−end stage. The Synchronization Outputs (Lgs and Hgs) In addition to the power drivers, this IC features two ground referenced low power synchronization outputs that can be used to drive second power driver (in full bridge applications) or to trigger synchronous rectification circuitry via isolation transformer. On−time of the synchronization outputs can be easily clamped to needed value using a single resistor connected from the Dgs pin to ground. Maximum feasible on−time of the synchronization outputs is never higher than the on−time of the power outputs. Please refer to Figures 35 and 37 for more details on how the synchronization output signals are generated. The selection table for the Rdgs resistor that dictates the maximum on−time on the Lgs ang Hgs outputs can be seen in Figure 58. 5 7 9 11 13 15 17 19 10 15 20 25 30 40 45 55 Figure 58. On Time Clamp Selection Chart Rdgs (kW) 35 50 Layout Recommendations The DDA002C contains sensitive inputs that uses high resistance resistors (depends on desired operating frequency range, deadtime and sync outputs on time clamp duration). Mentioned high impedance inputs can be sensitive to noise generated by HB and/or driver pins. Care thus has to be taken during SMPS layout design. Please refer to Figure 59 for recommended layout. |
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