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PIC16F87-I/ML Datasheet(PDF) 190 Page - Microchip Technology

Part # PIC16F87-I/ML
Description  18/20/28-Pin Enhanced FLASH Microcontrollers with nanoWatt Technology
PDF  214 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16F87-I/ML Datasheet(HTML) 190 Page - Microchip Technology

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PIC16F87/88
DS30487B-page 188
Preliminary
 2003 Microchip Technology Inc.
TABLE 18-13: A/D CONVERTER CHARACTERISTICS: PIC16F87/88 (INDUSTRIAL, EXTENDED)
PIC16LF87/88 (INDUSTRIAL)
Param
No.
Sym
Characteristic
Min
Typ†
Max
Units
Conditions
A01
NR
Resolution
—
—
10 bits
bit
VREF = VDD = 5.12V,
VSS
≤ VAIN ≤ VREF
A03
EIL
Integral linearity error
—
—
< ± 1
LSb
VREF = VDD = 5.12V,
VSS
≤ VAIN ≤ VREF
A04
EDL
Differential linearity error
—
—
< ± 1
LSb
VREF = VDD = 5.12V,
VSS
≤ VAIN ≤ VREF
A06
EOFF
Offset error
—
—
< ± 2
LSb
VREF = VDD = 5.12V,
VSS
≤ VAIN ≤ VREF
A07
EGN
Gain error
—
—
< ± 1
LSb
VREF = VDD = 5.12V,
VSS
≤ VAIN ≤ VREF
A10
—
Monotonicity(3)
—
guaranteed
—
—
VSS
≤ VAIN ≤ VREF
A20
VREF
Reference Voltage
2.5
2.2
—
—
VDD + 0.3
VDD + 0.3
V
V
-40°C to +85°C
0°C to +85°C
A21
VREF+ Reference voltage high
AVDD – 2.5V
AVDD + 0.3V
V
A22
VREF- Reference voltage low
AVSS – 0.3V
VREF+ – 2.0V
V
A25
VAIN
Analog input voltage
VSS – 0.3V
—
VREF + 0.3V
V
A30
ZAIN
Recommended impedance of
analog voltage source
——2.5
k
Ω See (Note 4)
A50
IREF
VREF input current(2)
—
—
—
—
5
500
µA
µA
During VAIN acquisition.
Based on differential of VHOLD to
VAIN to charge CHOLD, see
Section 12.1 “A/D Acquisition
Requirements”.
During A/D Conversion cycle.
†
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note
1:
VREF current is from RA3 pin or VDD pin, whichever is selected as reference input.
2:
The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes.
3:
The maximum allowed impedance for analog voltage source is 10 k
Ω. This requires higher acquisition times.



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